FARAZ UDDIN SYED
Dresden,Germany
Overview
11
11
years of professional experience
4
4
years of post-secondary education
Work history
IC PACKAGE DESIGN ENGINEER
Racyics
DRESDEN, GERMANY
10.2024 - 02.2025
PCB DESIGNER
VALEO
BIETIGHEIM BISSINGEN, GERMANY
01.2024 - 07.2024
PCB designer
HUAWEI
NUREMBERG, GERMANY
06.2023 - 12.2023
IC PACKAGE AND PCB DESIGN ENGINEER
iPronics
VALENCIA, SPAIN
06.2021 - 03.2023
SENIOR DESIGN ENGINEER
ADVANTEST
KARACHI, PAKISTAN
02.2016 - 05.2021
VOLUNTEER
FAMILY EXPO AND TALENT AWARD
KARACHI, PAKISTAN
06.2014 - 06.2014
Education
Bachelor of Science - ELECTRONIC ENGINEERING
SIR SYED UNIVERSITY OF ENGINEERING AND TECHNOLOGY
KARACHI,PAKISTAN 01.2011 - 12.2014
Skills
- Projektmanagement
- Kommunikationsfähigkeit
- Teamarbeit
- Multitasking
- Körperliche Ausdauer und Leistungsfähigkeit
- Problemlösungsfähigkeiten
- Zeitmanagement
SPRACHEN
English
Fluent
German
Intermediate
DIGITALE KOMPETENZEN
MICROSOFT OFFICE
Microsoft Word
Microsoft Powerpoint
Microsoft Excel
Microsoft Outlook
Timeline
IC PACKAGE DESIGN ENGINEER
Racyics
10.2024 - 02.2025
PCB DESIGNER
VALEO
01.2024 - 07.2024
PCB designer
HUAWEI
06.2023 - 12.2023
IC PACKAGE AND PCB DESIGN ENGINEER
iPronics
06.2021 - 03.2023
SENIOR DESIGN ENGINEER
ADVANTEST
02.2016 - 05.2021
VOLUNTEER
FAMILY EXPO AND TALENT AWARD
06.2014 - 06.2014
Bachelor of Science - ELECTRONIC ENGINEERING
SIR SYED UNIVERSITY OF ENGINEERING AND TECHNOLOGY
01.2011 - 12.2014