FARAZ UDDIN SYED
Dresden,Germany
Overview
11
11
years of professional experience
4
4
years of post-secondary education
Work history
IC PACKAGE DESIGN ENGINEER
Racyics
DRESDEN, GERMANY
2024.10 - 2025.02
PCB DESIGNER
VALEO
BIETIGHEIM BISSINGEN, GERMANY
2024.01 - 2024.07
PCB designer
HUAWEI
NUREMBERG, GERMANY
2023.06 - 2023.12
IC PACKAGE AND PCB DESIGN ENGINEER
iPronics
VALENCIA, SPAIN
2021.06 - 2023.03
SENIOR DESIGN ENGINEER
ADVANTEST
KARACHI, PAKISTAN
2016.02 - 2021.05
VOLUNTEER
FAMILY EXPO AND TALENT AWARD
KARACHI, PAKISTAN
2014.06 - 2014.06
Education
Bachelor of Science - ELECTRONIC ENGINEERING
SIR SYED UNIVERSITY OF ENGINEERING AND TECHNOLOGY
KARACHI,PAKISTAN 2011.01 - 2014.12
Skills
- Projektmanagement
- Kommunikationsfähigkeit
- Teamarbeit
- Multitasking
- Körperliche Ausdauer und Leistungsfähigkeit
- Problemlösungsfähigkeiten
- Zeitmanagement
SPRACHEN
English
Fluent
German
Intermediate
DIGITALE KOMPETENZEN
MICROSOFT OFFICE
Microsoft Word
Microsoft Powerpoint
Microsoft Excel
Microsoft Outlook
Timeline
IC PACKAGE DESIGN ENGINEER
Racyics
2024.10 - 2025.02
PCB DESIGNER
VALEO
2024.01 - 2024.07
PCB designer
HUAWEI
2023.06 - 2023.12
IC PACKAGE AND PCB DESIGN ENGINEER
iPronics
2021.06 - 2023.03
SENIOR DESIGN ENGINEER
ADVANTEST
2016.02 - 2021.05
VOLUNTEER
FAMILY EXPO AND TALENT AWARD
2014.06 - 2014.06
Bachelor of Science - ELECTRONIC ENGINEERING
SIR SYED UNIVERSITY OF ENGINEERING AND TECHNOLOGY
2011.01 - 2014.12